RF and Microwave Microelectronics Packaging, 2010
Coordonnateurs : Kuang Ken, Kim Franklin, Cahill Sean S.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Date de parution : 09-2014
Ouvrage de 285 p.
15.5x23.5 cm
Date de parution : 11-2009
Ouvrage de 285 p.
15.5x23.5 cm