RF and Microwave Microelectronics Packaging II, 1st ed. 2017
Coordonnateurs : Kuang Ken, Sturdivant Rick
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ?RF and Microwave Microelectronics Packaging? (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers
Includes supplementary material: sn.pub/extras
Date de parution : 03-2017
Ouvrage de 172 p.
15.5x23.5 cm
Date de parution : 06-2018
Ouvrage de 172 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 89,66 €
Ajouter au panierMots-clés :
Microwave and millimeter-wave frequencies; EMI shielding; Chip size packaging for RF MEMS; Ceramic and Laminate packaging; High power electronics; Thermal management system design; Thin film substrate; Advanced power amplifiers; Millimeter wave circuit technology; Quality control and failure analysis; Waver level packaging; System integration packaging technologies; High thermal conductivity