Electrical Conductive Adhesives with Nanotechnologies, 2010

Langue : Anglais

Couverture de l’ouvrage Electrical Conductive Adhesives with Nanotechnologies

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?Electrical Conductive Adhesives with Nanotechnologies? begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Nanotechnology.- Characterizations of Electrically Conductive Adhesives.- Isotropically Conductive Adhesives (ICAs).- Anisotropically Conductive Adhesives/Films (ACA/ACF).- Non-Conductive Adhesives/Films (NCA/NCF).- Conductive Nano-Inks.- Intrinsically Conducting Polymers (ICPs).- Future Trend of Conductive Adhesive Technology.

Compares and contrasts lead-free soldering techniques and electrically conductive adhesives and discusses the advantages of electrically conductive adhesives Discusses isotropically conductive adhesives, anisotropically conductive adhesives/films, non-conductrice adhesives/films, their current applications, in industry, advantages and limitations, recent developments and nanotechnology applications Provides insight into the future of nano electrically conductive adhesives and industry trends Includes supplementary material: sn.pub/extras