Reliability of Microtechnology, 2011 Interconnects, Devices and Systems

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.

Discusses the general failure mechanisms of microsystems on a component level

Comprehensive coverage of solder joint reliability at the microsystems level

Includes accelerated testing of solder joints at the microsystems level

Discusses quality issues and manufacturing at the microsystems level

Includes supplementary material: sn.pub/extras