RF and Microwave Microelectronics Packaging II, Softcover reprint of the original 1st ed. 2017
Coordonnateurs : Kuang Ken, Sturdivant Rick
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ?RF and Microwave Microelectronics Packaging? (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Date de parution : 03-2017
Ouvrage de 172 p.
15.5x23.5 cm
Date de parution : 06-2018
Ouvrage de 172 p.
15.5x23.5 cm
Mots-clés :
Microwave and millimeter-wave frequencies; EMI shielding; Chip size packaging for RF MEMS; Ceramic and Laminate packaging; High power electronics; Thermal management system design; Thin film substrate; Advanced power amplifiers; Millimeter wave circuit technology; Quality control and failure analysis; Waver level packaging; System integration packaging technologies; High thermal conductivity