Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture Woodhead Publishing Series in Electronic and Optical Materials Series
Auteurs : Wong E-H, Mai Y.-W.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
Temperature induced failureMoisture induced failureMechanical shock induced failureAdhesive interconnects and viscoelasticityConcluding remarksPrograms and macro filesTemperature induced failureMoisture induced failureMechanical induced failure
- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
- Includes program files and macros for additional study
Date de parution : 05-2015
Ouvrage de 482 p.
15x22.8 cm
Thèmes de Robust Design of Microelectronics Assemblies Against... :
Mots-clés :
Damage driving forces; IC packaging; Microelectronic assemblies; Analytical solutions; Bonding; Sandwiched structure; Solder joints; Thermal stress; Creep-fatigue; Unified equation; Anisotropic diffusivity; Diffusivity; Moisture conditioning; Moisture sorption; Saturated concentration; Chemical potential; Moisture diffusion; Thermal-moisture analogy; Vapour pressure; Wetness; Drop impact; Lead-free solders; Physics of failure; Product drop impact; Ball impact shearing; Drop-impact test; High-speed cyclic bending; Environmental testing; Fatigue; High strain rate; Strain-life; Crack propagation; Fatigue crack growth; In situ crack monitoring; Acceleration-shock; Transient analysis; Mechanical bending; Constitutive properties; High strain rate testing; Solders; Stress-strain properties