More than Moore Technologies for Next Generation Computer Design, 2015

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ?More than Moore? (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ?Moore's Law?. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Introduces novel memories, using new materials and processing techniques, offering many advantages over dynamic memories such as traditional SRAM and e-DRAM

Describes 3D integration of integrated circuits, enabling stacking of layers and shrinking device to device distance over traditional packages

Enables readers to use on-chip integrated optics for interconnect

Includes coverage of technology, design, and design automation