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Url canonique : www.lavoisier.fr/livre/physique/diffusion-processes-in-advanced-technological-materials/gupta/descriptif_2295161
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Diffusion Processes in Advanced Technological Materials, 2005

Langue : Anglais

Coordonnateur : Gupta Devendra

Couverture de l’ouvrage Diffusion Processes in Advanced Technological Materials
My 12-year-old granddaughter Nina Alesi once asked me, "Grandpa, you are a scientist at IBM, so what do you do?" I tried to reply, "Oh, I watch atoms move. . . " But before I could finish this sentence, my 7-year-old grandson Vinnie interjected, "Grandpa, do atoms play soccer?" This book is about the games atoms play in diffusion and various other properties of materials. While diffusion has been studied for more than 100 years in solids, its importance, excitement, and intellectual chal­ lenges remain undiminished with time. It is central to understanding the relationship between the structure and properties of naturally occurring and synthetic materials, which is at the root of current technological development and innovations. The diversity of material has led to spec­ tacular progress in functional inorganics, polymers, granular materials, photonics, complex oxides, metallic glasses, quasi-crystals, and strongly correlated electronic materials. The integrity of complex materials pack­ ages is determined by diffusion, a highly interactive and synergic phe­ nomenon that interrelates to the microstructure, the microchemistry, and the superimposed physical fields. While the various physico-chemical properties of the materials are affected by diffusion, they determine diffu­ sion itself. This book, which is intended to document the diffusive processes operative in advanced technological materials, has been written by pio­ neers in industry and academia.
1. DIFFUSION IN BULK SOLIDS AND THIN FILMS: SOME PHENOMENOLOGICAL EXAMPLES, Devendra Gupta 2. SOLID STATE DIFFUSION AND BULK PROPERTIES, G.P. Tiwari, R.S. Mehrotra, and Y. Iijima 3. ATOMISTIC COMPUTER SIMULATIONS OF DIFFUSION, Y. Mishin 4. BULK AND GRAIN BOUNDARY DIFFUSION IN INTERMETALLIC COMPOUNDS, Christain Herzig and Sergiy Divinski 5. DIFFUSION BARRIERS IN SEMICONDUCTOR DEVICES/CIRCUITS, Shyam P. Murarka 6. REACTIVE PHASE FORMATION: SOME THEORY AND APPLICATIONS, F. M. d'Heurle, P. Gas, C. Lavoie, and J. Philibert. 7. METAL DIFFUSION IN POLYMERS AND ON POLYMER SURFACES, F. Faupel, A. Thran, V. Zaporojtchenko, T Strunskus and M. Kiene 8. MEASUREMENT OF STRESSES IN THIN FILMS AND THEIR RELAXATION, O. Kraft and H. Gao 9. ELECTROMIGRATION in Cu THIN FILMS, C.-K. Hu, L. Gignac, R. Rosenberg 10. DIFFUSION IN SOME PEROVSKITES: HIGH TEMPERATURE SUPER CONDUCTING AND A PIEZOELECTRIC CERAMIC, Devendra Gupta

Emphasizes interrelated diffusion along multiple path, microstructure, micro-chemistry fields of all kinds, particularly of the interfaces

Contains an entire chapter devoted to computer simulations of diffusion at the atomic level

Treats high temperature applications

Treats metal diffusion in polymers and on polymer surfaces

Treats electromigration in copper thin films

Treats newly discovered high temperature super conducting cuprates and some piezoelectric ceramics

Date de parution :

Ouvrage de 532 p.

15.5x23.5 cm

Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).

Prix indicatif 210,99 €

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Date de parution :

Ouvrage de 532 p.

15.5x23.5 cm

Sous réserve de disponibilité chez l'éditeur.

Prix indicatif 210,99 €

Ajouter au panier