Ultrasound Energy and Data Transfer for Medical Implants, 1st ed. 2020 Analog Circuits and Signal Processing Series
Auteurs : Mazzilli Francesco, Dehollain Catherine
- Provides a complete, system-level perspective on the use of ultrasound as energy source for medical implants;
- Discusses system design concerns regarding wireless power transmission and wireless data communication, particularly for a system in which both are performed on the same channel/frequency;
- Describes an experimental study on implantable battery powered biomedical systems;
- Presents a fully-integrated, implantable system and hermetically sealed packaging.
Introduction.- Ultrasound in Medicine.- Regulations and System Specifications.- System Architecture: Control Unit.- System Architecture: Transponder.- Wireless Power Transfer (WPT) and Communication.- Conclusion.
Franceco Mazzilli was born in Turin, Italy, in 1983. He received the B.Sc. degree in electrical engineering from the Polytechnic University of Turin, Turin, Italy, in 2005, the M.Sc. degree in micro- and nano-technologies for integrated systems, issued jointly from the Institut National Polytechnique de Grenoble, Grenoble, France, and Ecole Polytechnique Federale de Lausanne (EPFL), Lausanne, Switzerland, in 2007, and the Ph.D. degree in microsystems and microelectronics from EPFL in 2013. In March 2008, he joined the Electronics Lab at EPFL as a Research Assistant in the field of RFIC design. His research interests include analog and RF CMOS circuit design for power management, wireless systems, and MEMS/NEMS applications. He is an analog design engineer at Melexis Technologies SA in Chemin Bevaix, Switzerland.
Provides a complete, system-level perspective on the use of ultrasound as energy source for medical implants
Discusses system design concerns regarding wireless power transmission and wireless data communication, particularly for a system in which both are performed on the same channel/frequency
Describes an experimental study on implantable battery powered biomedical systems
Presents a fully-integrated, implantable system and hermetically sealed packaging
Date de parution : 09-2021
Ouvrage de 155 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 52,74 €
Ajouter au panierDate de parution : 09-2020
Ouvrage de 155 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 52,74 €
Ajouter au panier