Foldable Flex and Thinned Silicon Multichip Packaging Technology, 2003 Emerging Technology in Advanced Packaging Series, Vol. 1
Coordonnateur : Balde John W.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Date de parution : 02-2014
Ouvrage de 347 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 158,24 €
Ajouter au panierDate de parution : 01-2003
Ouvrage de 347 p.
15.5x23.5 cm
Thème de Foldable Flex and Thinned Silicon Multichip Packaging... :
Mots-clés :
circuit; design; development; electronics; interconnect; material; microprocessor; power systems; processor; production; system on chip (SoC)