Lavoisier S.A.S.
14 rue de Provigny
94236 Cachan cedex
FRANCE

Heures d'ouverture 08h30-12h30/13h30-17h30
Tél.: +33 (0)1 47 40 67 00
Fax: +33 (0)1 47 40 67 02


Url canonique : www.lavoisier.fr/livre/physique/investigations-on-microstructure-and-mechanical-properties-of-the-cu-pb-free-solder-joint-interfaces/descriptif_3815995
Url courte ou permalien : www.lavoisier.fr/livre/notice.asp?ouvrage=3815995

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces, 1st ed. 2016 Springer Theses Series

Langue : Anglais

Auteur :

Couverture de l’ouvrage Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.

Nominated by the Chinese Academy of Sciences as an outstanding thesis in the field

Illustrates the damage behavior of a series of Pb-free solder joints under different loading conditions

In-situ characterization techniques are used to reveal the dynamic damage process in solder joints

The fracture behavior and fracture strength of the Cu-Sn intermetallic compound are tested

Date de parution :

Ouvrage de 143 p.

15.5x23.5 cm

Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).

105,49 €

Ajouter au panier

Date de parution :

Ouvrage de 143 p.

15.5x23.5 cm

Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).

105,49 €

Ajouter au panier
En continuant à naviguer, vous autorisez Lavoisier à déposer des cookies à des fins de mesure d'audience. Pour en savoir plus et paramétrer les cookies, rendez-vous sur la page Confidentialité & Sécurité.
FERMER