Hot Carrier Degradation in Semiconductor Devices, 2015
Coordonnateur : Grasser Tibor
This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today?s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (?become hot?), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.
Method for Assessing Hot Carrier Degradation.- Recovery from Hot Carrier Induced Degradation Through Temperature Treatment.- Characterization of MOSFET Interface States Using the Charge Pumping Technique.- Part II: CMOS and Beyond.- Channel Hot Carriers in SiGe and Ge pMOSFETs.- Channel Hot Carrier Degradation and Self-Heating Effects in FinFETs.- Characterization and Modeling of High-Voltage LDMOS Transistors.- Compact modelling of the Hot-carrier Degradation of Integrated HV MOSFETs.- Hot-Carrier Degradation in Silicon-Germanium Heterojunction Bipolar Transistors.- Part III: Circuits.- Hot-Carrier Injection Degradation in Advanced CMOS nodes: A bottom-up approach to circuit and system reliability.- Circuit Reliability – Hot Carrier Stress of MOS-transistors in Different Fields of Application.- Reliability Simulation Models for Hot Carrier Degradation.
Describes the intricacies of hot carrier degradation in modern semiconductor technologies
Covers the entire hot carrier degradation phenomenon, including topics such as characterization, carrier transport, carrier-defect interaction, technological impact, circuit impact, etc
Enables detailed understanding of carrier transport, interaction of the carrier ensemble with the defect precursors, and an accurate assessment of how the newly created defects impact the device performance
Covers modeling issues starting from detailed physics-based TCAD approaches up to efficient SPICE-compatible compact models
Includes supplementary material: sn.pub/extras
Date de parution : 09-2016
Ouvrage de 517 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 118,31 €
Ajouter au panierDate de parution : 11-2014
Ouvrage de 517 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 105,49 €
Ajouter au panier