Factors Governing Tin Whisker Growth, Softcover reprint of the original 1st ed. 2013 Springer Theses Series
Auteur : Crandall Erika R
Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems.
This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
Whiskers and Their Role in Component Reliability.- Film/Substrate Effects on Whisker Growth.- Environmental Effects of Whisker Growth.- Whisker Mitigation and Prevention.- Conclusions.
Nominated by Auburn University, USA, as an outstanding Ph.D. thesis
Identifies and defines several factors that govern whisker formation and growth
Describes whisker prevention using a variety of impenetrable topside hard metal films which prevent Sn whiskers from penetrating through capping barriers
Studies why particular topside metal films prevent whisker growth while others do not
Includes supplementary material: sn.pub/extras
Date de parution : 08-2016
Ouvrage de 136 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 105,49 €
Ajouter au panierDate de parution : 09-2013
Ouvrage de 136 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 105,49 €
Ajouter au panierThèmes de Factors Governing Tin Whisker Growth :
- structure électronique / propriétés électriques et magnétiques (semi-conducteurs, supraconductivité, transport et diffusion électronique)
- soudage et assemblage
- théories / appareillages / composants
- circuits électroniques / circuits hyperfréquences
- surfaces et interfaces / couches minces / dépôt de couches minces