Flexible, Wearable, and Stretchable Electronics Devices, Circuits, and Systems Series
Coordonnateur : Sakuma Katsuyuki
Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not capable of. This is because flexible electronics will allow us to build flexible circuits and devices on a substrate that can be bent, stretched, or folded without losing functionality. This revolutionary change will impact how we interact with the world around us. Future electronic devices will use flexible electronics as part of ambient intelligence and ubiquitous computing for many different applications such as consumer electronics, medical, healthcare, and security devices. Thus, these devices have the potential to create a huge market all over the world.
Flexible, Wearable, and Stretchable Electronics, provide a comprehensive technological review of the state-of-the-art developments in FWS electronics. This book offers the reader a taste of what is possible with FWS electronics and describes how these electronics can provide unique solutions for a wide variety of applications. Furthermore, the book introduces and explains new applications of flexible technology that has opened up the future of FWS electronics.
Katsuyuki Sakuma is a research staff member at the IBM Thomas J. Watson Research Center in NY. He is also a Visiting Professor at the Department of Biomedical Engineering, Tohoku University, Japan and at National Chiao Tung University, Taiwan.
Date de parution : 05-2022
17.8x25.4 cm
Date de parution : 11-2020
17.8x25.4 cm
Thèmes de Flexible, Wearable, and Stretchable Electronics :
Mots-clés :
Stretchable Conductors; Industrial developments; Wearable Electronics; Flexible electronic applications; Flexible Electronics; Conventional semiconductors; Organic Semiconductors; FWS electronics; Stretchable Electronics; ACF; SEM Image; Flexible Substrates; Liquid Metal; ACS Publication; OLED Device; Flexure Cycles; Cross-sectional SEM Image; Acceleration Sensor; Sintering Temperature; 4G LTE; Opv Device; Oxide Skin; Bending Stress; National Academy; Sensor Sheet; Amp; ANSYS HFSS; Si Chip; Peel Adhesion Strength