Thermal management handbook for electronic assemblies

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Langue : Anglais
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Ouvrage 650 p. · 15.5x23.5 cm · Relié
Introduction. Electronic packaging technology. Thermal properties of electronics materials. Heat generation in electronic circuits. Basic thermal analysis. Thermal analysis of electronic assemblies. Cooling of electronic assemblies data.
Introduction. Electronic Packaging Technology. Thermal Properties of Electronic Materials. Heat Generation in Electronic Circuits. Basic Thermal Analysis. Thermal Analysis of Electronic Assemblies. Cooling of Electronic Assemblies. Data.
This book provides a comprehensive information source for the thermal management of printed circuit boards, hybrid circuits and multichip modules. Containing tutorial chapters, data tables and a wealth of design examples, this reference will cover the basics of practical thermal management.