Surface Mount Technology (2^nd Ed., 2nd ed. 1997) Principles and Practice

A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve­ ment will span half a century.

One Introduction to Surface Mounting.- 1 Introduction to Surface Mount Technology.- 2 Implementing SMT In-House and at Subcontractors.- Two Designing with Surface Mounting.- 3 Surface Mount Components.- 4 Substrates for Surface Mounting.- 5 Surface Mount Design Considerations.- 6 Surface Mount Land Pattern Design.- 7 Design for Manufacturability, Testing, and Repair.- Three Manufacturing with Surface Mounting.- 8 Adhesive and Its Application.- 9 Solder Paste and Its Application.- 10 Metallurgy of Soldering and Solderability.- 11 Component Placement.- 12 Soldering of Surface Mounted Components.- 13 Flux and Cleaning.- 14 Quality Control, Inspection Repair, and Testing.- Appendix A.- Surface Mount Standards.- Appendix B.- Detailed Questionnaire for Evaluating Smt Equipment:Pick-and-Place (Appendix B1), Screen Printer (Appendix B2), and Reflow Oven (appendix b3).- Appendix c glossary.