Microwave and Millimeter-Wave Electronic Packaging

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules; 3D Packaging; Package and Integrated Circuit as a System; Thermal; Electromagnetic Modeling; Conclusions and New Horizons in High Frequency Electronic Packages; Appendices.