Failure-free integrated circuit packages

Driven by the fast-growing market for personal electronic devices, integrated circuit complexity has increased as feature sizes shrink. The resulting integrated circuit devices are prone to more frequent failures, which must be found, identified, and fixed. This unique reference uses graphic illustrations to clearly identify all major failure mode types, allowing engineers to spot failures before they occur.

Introduction. Fundamentals of IC Package Technologies. Device Reliability. Physics and Chemistry of Failures in Packaged Devices. Strategies for Locating Failures. Failure Analysis Techniques. Examples of Failure Modes Common in Organic IC Packages. Emerging Assembly Materials for IC Packaging.