Handbook of Silicon Wafer Cleaning Technology (3rd Ed.)
Coordonnateurs : Reinhardt Karen, Kern Werner
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.
The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
Part 1: Introduction and Overview 1. Overview and Evolution of Silicon Wafer Cleaning Technology 2. Overview of Wafer Contamination and Defectivity
Part 2: Wet-Chemical Processes 3. Particle Deposition and Adhesion 4. Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes 5. Gas-phase Wafer Cleaning Technology 6. Plasma Stripping and Cleaning 7. Cryogenic Aerosols and Supercritical Fluid Cleaning
Part 4: Analytical and Control Aspects 8. Detection and Measurement of Particulate Contaminants 9. Surface Chemical Composition and Morphology 10. Ultratrace Impurity and Surface Morphology Analysis
Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries
- Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits
- Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries
- Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Date de parution : 03-2018
Ouvrage de 760 p.
15x22.8 cm
Thèmes de Handbook of Silicon Wafer Cleaning Technology :
- Génie chimique - techniques industrielles - génie des procédés
- physico-chimie des surfaces / electrochimie
- fluides et plasmas
- surfaces et interfaces / couches minces / dépôt de couches minces
- structure électronique / propriétés électriques et magnétiques (semi-conducteurs, supraconductivité, transport et diffusion électronique)
Mots-clés :
Aqueous cleaning; Chemometrics; Cleaning; Concentration monitoring; Conductivity; Contamination; Critical cleaning; Drying; Fourier transform; Grating; Metrology; Mixed fluid jet; Multivariate analysis; Near-infrared spectroscopy; Particle removal; Photoresist removal; Process control; Resistivity; Rinsing; Semiconductor; Spectrometer; Surface conditioning; Surface roughness; Surface tension gradient drying; Watermarks