Thin-Film Capacitors for Packaged Electronics, Softcover reprint of the original 1st ed. 2004
Auteurs : Pushkar Jain, Rymaszewski Eugene J.
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
Date de parution : 02-2014
Ouvrage de 158 p.
15.5x23.5 cm
Date de parution : 11-2003
Ouvrage de 158 p.
15.5x23.5 cm
Thème de Thin-Film Capacitors for Packaged Electronics :
Mots-clés :
adhesion; circuit; design; dielectrics; electronics; interconnect; magnetism; material; metals; modeling; power distribution; power electronics; signal; thin films; transmission