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RF and mm-Wave Power Generation in Silicon

Langue : Anglais

Coordonnateurs : Wang Hua, Sengupta Kaushik

Couverture de l’ouvrage RF and mm-Wave Power Generation in Silicon

RF and mm-Wave Power Generation in Silicon presents the challenges and solutions of designing power amplifiers at RF and mm-Wave frequencies in a silicon-based process technology. It covers practical power amplifier design methodologies, energy- and spectrum-efficient power amplifier design examples in the RF frequency for cellular and wireless connectivity applications, and power amplifier and power generation designs for enabling new communication and sensing applications in the mm-Wave and THz frequencies.

With this book you will learn:

  • Power amplifier design fundamentals and methodologies
  • Latest advances insilicon-based RF power amplifier architectures and designs and their integration in wireless communication systems
  • State-of-the-art mm-Wave/THz power amplifier and power generation circuits and systems in silicon

1. Introduction

Part I: Power amplifier design methodologies 2. Power amplifier fundamentals

Part II: RF Power Amplifier Design Examples 3. CMOS power amplifier design for wireless connectivity applications: A highly linear WLAN power amplifier in advanced SoC CMOS 4. CMOS power amplifier design for cellular applications: An EDGE/GSM dual-mode quad-band PA in 0.18 µm CMOS 5. Energy-efficiency enhancement and linear amplifications: A transformer-based Doherty approach 6. Linear power amplification with high back-off efficiency: An out-phasing approach 7. Energy efficiency enhancement and linear amplifications: An envelope-tracking (ET) approach 8. A digital RF power amplification technique based on the switched-capacitor circuit 9. A transformer-based reconfigurable digital polar Doherty power amplifier fully integrated in bulk CMOS

Part III: mm-Wave and Terahertz Power Generation Design Examples 10. 60 GHz all silicon radio IC: How it all started 11. mm-Wave power-combining architectures: Current combining 12. mm-Wave power-combining architectures: Hybrid combining 13. mm-Wave CMOS design above 60 GHz 14. Self-healing techniques for robust mm-Wave power amplification 15. mm-Wave class-E PA design in CMOS 16. High-speed, efficient, mm-Wave power-mixer-based digital transmitters 17. THz power generation beyond transistor fmax 18. THz signal generation, radiation, and beam-forming in silicon: A circuit and electromagnetics co-design approach 19. Silicon-based THz signal generation with multiphase subharmonic injection-locking oscillators

Design engineers of Analog and IC Circuits

Hua Wang Hua Wang (M’05?SM’15) received his B.S. degree from Tsinghua University, Beijing, China, in 2003, and M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, in 2007 and 2009, respectively.

He was with Guidant Corporation during the summer of 2004, working on accelerometer-based posture monitoring systems for implantable biomedical devices. In 2010, he joined Intel Corporation, where he worked on the next generation energy-efficient mm-wave communication link and broadband CMOS Front-End-Module for Wi-Fi systems. In 2011, he joined Skyworks Solutions. His work at Skyworks included the development of SAW-less integrated filter solutions for low-cost cellular-standard Front-End-Module. In 2012, he joined the School of Electrical and Computer Engineering at Georgia Institute of Technology as an assistant professor. He currently holds the Demetrius T. Paris Junior Professorship of the School of Electrical and Computer Engineering. He is generally interested in innovating mixed-signal, RF, and mm-Wave integrated circuits and systems for communication, radar, and bioelectronics applications.

Dr. Wang received National Science Foundation (NSF) CAREER Award in 2015, Roger P. Webb ECE Outstanding Junior Faculty Member Award in 2015, and Lockheed Martin Dean’s Excellence in Teaching Award in 2015. He was the award recipient of the 46th IEEE DAC/ISSCC Student Design Contest Winner in 2009 based on his work of “An Ultrasensitive CMOS Magnetic Biosensor Array for Point-Of-Care (POC) Microarray Application.” He was also a co-recipient of the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Best Student Paper Award (1st Place) as the students’ Ph.D. advisor in 2014.

Dr. Wang is an Associate Editor of the IEEE Microwave and Wireless Components Letters (MWCL). He is currently a Technical Program Committee (TPC) Member for IEEE Radio Frequency Integrated Circuits Symposium (RFIC), IEEE Custom Inte

  • Extensive coverage from fundamentals to advanced design topics, focusing on various layers of abstraction: from device modeling and circuit design strategy to advanced digital and mixed-signal architectures for highly efficient and linear power amplifiers
  • New architectures for power amplifiers in the cellar and wireless connectivity covering detailed design methodologies and state-of-the-art performances
  • Detailed design techniques, trade-off analysis and design examples for efficiency enhancement at power back-off and linear amplification for spectrally-efficient non-constant envelope modulations
  • Extensive coverage of mm-Wave power-generation techniques from the early days of the 60 GHz research to current state-of the-art reconfigurable, digital mm-Wave PA architectures
  • Detailed analysis of power generation challenges in the higher mm-Wave and THz frequencies and novel technical solutions for a wide range for potential applications, including ultrafast wireless communication to sensing, imaging and spectroscopy
  • Contributions from the world-class experts from both academia and industry

Date de parution :

Ouvrage de 576 p.

19x23.3 cm

Disponible chez l'éditeur (délai d'approvisionnement : 14 jours).

126,84 €

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Thèmes de RF and mm-Wave Power Generation in Silicon :

Mots-clés :

60 GHz; 60GHz; AM-AM; AM-PM; Advanced CMOS; Amplifier; Antenna; Antenna mismatch; Auxiliary; Back-off; Beam-scanning; BiCMOS integrated circuits; CMOS; CMOS PA; CMOS integrated circuits; Class-D; Class-E; Conduction angle; Conjugate matching; Cross-coupled; Digital; Doherty; Doherty power amplifier; EER; Efficiency; Efficiency enhancement; Envelope elimination and restoration; Envelope modulator (EM); Envelope tracking (ET); Envelope-shaping method; Frequency multiplier; Harmonic generation; Impedance matching; Injection locking; Integrated PA; Integrated circuits; Linear; Linear power amplifier; Linearity; Load-line plot; Load-pull plot; Long-term evolution (LTE); Matching; Millimeter wave; Millimeter wave power amplifier; Millimeter-wave; Mm-Wave; Multi-mode and multi-band (MMMB); Multiphase oscillator; Nonlinear capacitance; OFDM; On chip antenna; On-chip antenna; On-chip passive device; Oscillator; Outphasing; Performance yield; Phased array; Polar modulation; Polar transmitter; Power (load-line) matching; Power amplifier; Power amplifier (PA); Power combiner; Power combining; Power efficiency; Power gain; Power mixer; Process variation; Push-push; Push-push oscillator; Quadruple-push; Quasi-optical; RF DAC; Radiation; Reconfigurability; Reconfigurable; SCPA; SOI CMOS; Self-healing; Series combining transformer; Shielded concentric transformers; SiGe power amplifier (SiGe PA); Signal source; SoC; Sub-terahertz; Submillimeter wave; Surface wave; Switched-capacitor power amplifier; Switching power amplifier; Terahertz; Through-silicon-via (TSV); Transceiver; Transformer; Transformer-based power combiner; Transformers; Transmission lines; Transmitter; Traveling wave; W-band