Power Electronic Packaging, 2012 Design, Assembly Process, Reliability and Modeling
Challenges of Power Electronic Packaging.- Power Package Electrical Isolation Design.- Discrete Power MOSFET Package Design and Analysis.- Power IC Packaging Design and Analysis.- Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations.- Thermal Management, Design and Cooling for Power Electronics.- Material Characterization for Power Electronics Packaging.- Power Package Typical Assembly Process.- Power Packaging Typical Reliability and Tests.- Power Packaging Modeling and Challenges.- Power Package Thermal and Mechanical Co-Design Simulation Automation.- Power Package Electrical and Multiple Physics Simulation.
Ouvrage de 594 p.
15.5x23.5 cm
Date de parution : 02-2012
Ouvrage de 594 p.
15.5x23.5 cm