Particles on Surfaces 1, 1988 Detection, Adhesion, and Removal

This volume chronicles the proceedings of the Symposium on Particles on Surfaces: Detection, Adhesion and Removal held under the auspices of the Fine Particle Society in San Francisco, July 28-August 2, 1986. The study of particles on surfaces is extremely important in many areas of human endeavor (ranging from microelectronics to optics to biomedical). A complete catalog of modern precision and sophisticated technologies where particles on surfaces are of cardinal importance will be prohibitively long, but the following eclectic examples should underscore the concern about particles on a variety of surfaces. In the semiconductor world of shrinking dimensions, particles which, a few years ago, were cosmetically undesirable but functionally innocuous can potentially be killer defects now. As the device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, and if a particle is trapped in the gap that can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces is all too manifest. So the particulate contamination on surfaces is undesirable from functional, yield and reliability points of view. This symposium was organized with the following objectives in mind: to bring together active practitioners in this field; to provide a forum for discussion of the latest research and development activities in this area; to provide opportunity for cross-pollination of ideas; and to highlight topics which needed intensified effort.

I. General Papers.- Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry.- Cleaning Semiconductor Surfaces: Facts and Foibles.- Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers.- Measuring Aerosol Particle Concentration in Clean Rooms and Particle Areal Density on Silicon Wafer Surfaces.- Particulate Contamination on Wafer Surfaces Resulting From Hexamethyldisilazane/Water Interactions.- Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices.- Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data.- Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings.- Implications of Particulate Contamination in the Performance of Floppy Disks.- II. Particle-Substrate Interaction and Particle Adhesion.- A Theoretical Review of Particle Adhesion.- The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate.- Electrostatic Charge Generation on Wafer Surfaces and Its Effect on Particulate Deposition.- Toner Adhesion in Electrophotography.- Adhesion and Removal of Particles: Effect of Medium.- Strong Adhesion of Dust Particles.- Prevention of Strong Adhesion of Dust Particles.- Dynamic Adhesion of Particles Impacting a Cylinder.- Crossed Fiber Models of the Particle-Surface Interaction.- Sensitive New Method for the Determination of Adhesion Force Between a Particle and a Substrate.- III. Particle Detection, Analysis and Characterization.- Detection of Particles on Clean Surfaces.- Detection of Particles Down to a “Few” Micrometers on Non-Specular Microelectronic Substrates and Other Surfaces.- Accurate Particle Counting for Bare Substrate Inspection.- Automated SEM/EDS ImageAnalysis of Particles on Filter Blanks.- Particle Sizing and Counting with the Inspex EX20/20.- IV. Particle Removal.- Methods for Surface Particle Removal: A Comparative Study.- Electrostatic Removal of Particles from Surfaces.- Electric Field Detachment of Charged Particles.- A New Approach to the Removal of Sub-Micron Particles From Solid (Silicon) Substrates.- About the Contributors.