Metal-Dielectric Interfaces in Gigascale Electronics, Softcover reprint of the original 1st ed. 2012 Thermal and Electrical Stability Springer Series in Materials Science Series, Vol. 157

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying  the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate  interface phenomena and the principles that govern them.

Preface

1. Introduction
1.1 Metal-dielectric interfaces in IC chips
1.2 Materials choices
1.3 Thermal and electrical stability

2. Metal-Dielectric Diffusion Processes: Fundamentals
2.1  Thermal diffusion
2.2  Field-enhanced ion drift
2.3  Thermodynamics and chemical interactions
2.4  Summary

3. Experimental Techniques
3.1 Test structures
3.2 Electrical measurements
3.3 Elemental characterizations
3.4 Summary

4. Al-Dielectric Interfaces
4.1 Al-SiO₂ interface
4.2 Al/low-k dielectric interfaces
4.3 Chemical identification of Al-ion drift
4.4 SiO₂ as a dielectric barrier against Al-ion drift
4.5 Summary

5. Cu-Dielectric Interfaces
5.1 Stability of Cu-SiO₂ in an oxygen-free environment
5.2 Instability of Cu-SiO₂ in an oxygen-containing environment
5.3 Origin of Cu ions in SiO₂
5.4 Cu ion diffusivity inside SiO₂
5.5 Cu ions in porous low-k dielectrics
5.6 Pre-cleaning of Cu/low-k dielectrics
5.7 Cu atoms in porous low-k dielectrics
5.8 Dielectrics containing no oxygen
5.9 Summary

7. Self-Forming Barriers
7.1 General considerations
7.2 Cu(Al) self-forming barrier
7.3 Cu(Mg) self-forming barrier           
7.4. Cu(Mn) self-forming barrier
7.5 Refractory metal self-forming barrier alloys
7.6 Summary

8. Kinetics of Ion Drift
8.1 Ion distribution simulations
8.2 Leakage current
8.3 C-V characteristics
8.4 Summary

9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions
9.1 Time-dependent dielectric breakdown (TDDB)
9.2 Dielectric pore-sealing
9.3 Resistance-switching memory
9.4 Summary

Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces

Features fundamental considerations in the physics and chemistry of metal-dielectric interactions

Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics

Provides keys to understanding reliability in gigascale electronics

Focuses on a dynamic area of current research that is a foundation of future interconnect systems, memristors, and solid-state electrolyte devices

Includes supplementary material: sn.pub/extras