MEMS Design and Fabrication
Coordonnateur : Gad-el-Hak Mohamed
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection of MEMS knowledge available, packaged in an attractive slipcase and offered at a substantial savings. This best-selling handbook is now more convenient than ever, and its coverage is unparalleled.
The second volume, MEMS: Design and Fabrication, details the techniques, technologies, and materials involved in designing and fabricating MEMS devices. It begins with an overview of MEMS materials and then examines in detail various fabrication and manufacturing methods, including LIGA and macromolding, X-ray based fabrication, EFAB® technology, and deep reactive ion etching. This book includes three new chapters on polymeric-based sensors and actuators, diagnostic tools, and molecular self-assembly. It is a thorough guide to the important aspects of design and fabrication.
MEMS: Design and Fabrication comprises contributions from the foremost experts in their respective specialties from around the world. Acclaimed author and expert Mohamed Gad-el-Hak has again raised the bar to set a new standard for excellence and authority in the fledgling fields of MEMS and nanotechnology.
Date de parution : 12-2019
17.8x25.4 cm
Date de parution : 11-2005
Ouvrage de 700 p.
17.8x25.4 cm
Thèmes de MEMS :
Mots-clés :
microelectromechanical; system; surface; micromachining; deep; reactive; ion; etching; etch; Propylene Glycol Methyl Ether Acetate; rate; STM Image; LPCVD Polysilicon; PZT Film; Etch Rates; X-ray Lithography; X-ray Mask; Au Thick Film; Surface Micromachining; NEMS Device; Polysilicon Surface Micromachining; Thick Film Metallization; PIV Recording; Cycle Time; SiC Etch Rate; Sacrificial Layer; Polysilicon Films; Mold Insert; Entrance Length; CTE Mismatch; Mem Device; Molecule Substrate Interactions; Hydrogen Sensor; Power Consumption; Schottky Diode