Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs, 2014
Auteurs : Noia Brandon, Chakrabarty Krishnendu
Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs
Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations
Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective
Date de parution : 08-2016
Ouvrage de 245 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 108,44 €
Ajouter au panierDate de parution : 12-2013
Ouvrage de 245 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 105,49 €
Ajouter au panier