Fundamentals of Lead-Free Solder Interconnect Technology, Softcover reprint of the original 1st ed. 2015 From Microstructures to Reliability
Auteurs : Lee Tae-Kyu, Bieler Thomas R., Kim Choong-Un, Ma Hongtao
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.
Date de parution : 10-2016
Ouvrage de 253 p.
15.5x23.5 cm
Date de parution : 11-2014
Ouvrage de 253 p.
15.5x23.5 cm
Disponible chez l'éditeur (délai d'approvisionnement : 15 jours).
Prix indicatif 105,49 €
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